2UUL BH17 CPUREBALL BASE

2UUL BH17 CPUREBALL BASE is a professional, magnetic, dual-sided CPU reballing platform set designed for micro-soldering repairs on both Apple and Android smartphones.

Key Specifications & Features

·         Dual-Sided Design: Features a double-sided configuration that supports two distinct chip heights and solder ball thicknesses. It includes T0.6 thickness for Apple and T0.35 thickness for Android devices.

·         Magnetic Stability: Equipped with high-strength, built-in dual magnets to firmly lock the CPU chip and stencil in place, preventing shifting during hot air reflow.

·         Premium Build: Constructed from a CNC-machined aluminum alloy and durable stainless steel to withstand high-temperature soldering without warping.

·         Physical Specs: The platform base measures 58 × 58 × 11 mm and weighs approximately 238g.

Compatibility & Included Kit

The kit serves as a comprehensive, all-in-one solution for chip reballing:

·         Included Stencils: Typically bundled with a complete set of 75 precision stencils.

·         Apple Compatibility: Supports a wide legacy and current range from iPhone 7 up to iPhone 17 Pro Max (covering A10 through A19 Pro processors).

·         Android Compatibility: Features extensive support for major chipsets, including Qualcomm (e.g., Snapdragon 8 Ultra / SM8750), MediaTek (MTK), Samsung Exynos, HiSilicon, as well as dedicated stencils for EMMC and RAM.