RELIFE HW21

RELIFE HW21 is a high-quality, medium-temperature leaded solder paste formulated with silver (Ag) and lead (Pb), featuring an optimized melting point of 183°C. It is widely used by electronics repair professionals for precision tasks such as Surface Mount Technology (SMT) patching, Ball Grid Array (BGA) reballing, and LED component welding.

Key Specifications

·         Melting Point: 183°C, which is ideal for shielding temperature-sensitive components from excessive heat.

·         Composition: Contains a specialized lead-silver mixture that dramatically improves electrical conductivity and mechanical bond strength.

·         Packaging Weight: Typically sold in 40g or 50g containers.

·         Formula Type: No-clean formula, meaning it leaves minimal, non-corrosive residue that does not require cleaning post-soldering.

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Performance Benefits

·         Strong Structural Integrity: The addition of silver prevents component shifting, limits tin bridging, and offers superior resistance to oxidation.

·         Excellent Wettability: Spreads smoothly with moderate humidity and viscosity, ensuring it does not dry out or agglomerate easily.

·         Flawless Joint Quality: Produces bright, full, and reliable solder joints while mitigating the risk of false or cold soldering.