RELIFE RL-404

RELIFE RL-404 is a professional-grade, lead-free low-temperature solder paste primarily designed for precision electronics and smartphone motherboard repair. It is a staple tool for technicians performing delicate BGA reballing and SMD micro-soldering.

Key Technical Specifications

·         Melting Point: 138°C (Low temperature prevents heat damage to surrounding sensitive chips).

·         Alloy Composition: Sn42 / Bi58 (42% Tin, 58% Bismuth).

·         Particle Size: 20–38 µm (Ultra-fine micron particles ensure smooth dispensing).

·         Flux Content: 9 ± 0.5 Wt%.

·         Viscosity: 178 ± 10 Pa·s.

·         Ideal Storage: 0–10°C refrigeration to extend shelf life past 12 months.

Key Benefits & Use Cases

·         ?? Motherboard Protection: Because it flows at a gentle 138°C, it safeguards multi-layered boards and nearby components (like phone CPUs or face ID modules) from overheating.

·         ?? No-Clean & High Wettability: It leaves minimal, non-conductive residue behind and retains its moisture for up to 36 hours after opening, preventing premature drying during long repair sessions.

·         ??? Form Factors: It is available as the standard RL-404 (40g tub) and the RL-404S variant (10ml syringe format with a needle/plunger for exact dosing)