YX-X4 REBALLING GLASS COVER
In mobile phone motherboard and IC repair, a reballing glass cover (often referred to as an anti-splash glass pad or explosion-proof glass) plays a crucial role during the BGA tin-planting process.
Core Functions of a Reballing Glass Cover
· Prevents Stencil Bulging: Stencils can warp or bulge under the intense direct heat of a hot air gun. Placing a heat-resistant glass cover over the stencil keeps it flat and flush against the IC chip.
· Eliminates Solder Ball Splashing: By sealing the top of the stencil holes, the glass prevents uneven thermal expansion from causing solder balls to blow out, explode, or bridge together.
· High-Temperature Resistance: These pads are made from specialized toughened, heat-insulated glass (often quartz or tempered glass) capable of enduring temperatures exceeding 300°C–400°C without cracking or warping.
Visual Clarity: Because the material is transparent, technicians can look directly through the microscope to observe the solder paste melting into uniform balls in real-time