RELIFE RL-007GA Jumping Wire Repair Solder Points/Lug Pad Set
The RELIFE RL-007GA Dot Repairing Solder Lug Pad Set is a precision micro-soldering repair accessory designed for restoring damaged, lifted, or missing solder pads on mobile phone motherboards and other PCBs. It provides replacement copper pads that can help simplify board repair without extensive coating removal or complicated jumper-wire work.
The set contains 1,400 various-sized high-conductivity copper pads arranged on transparent backing sheets for convenient selection and application. These replacement pads provide a conductive surface for repairing solder points and reconnecting components such as ICs and flex cables.
Specifications
- Model: RELIFE RL-007GA
- Type: Dot Repairing Solder Lug Pad Set
- Material: High-Conductivity Copper Foil
- Quantity: 1,400 Pads
- Pad Sizes: Various Sizes
- Backing: Transparent Sheets
- Application: PCB & Mobile Phone Motherboard Repair
- Suitable For: Damaged, Lifted & Missing Solder Pads
- Use: Micro-Soldering & Circuit Board Repair