RELIFE RL-403 180c BGA Solder Paste Flux
RELIFE RL-403 is a medium-temperature BGA solder paste designed for mobile phone motherboard, PCB, SMD, and BGA soldering repairs. It uses a Sn63/Pb37 tin-lead alloy with a melting point of approximately 183°C, providing reliable soldering performance for precision electronics work.
The fine 20–38 µm particles offer good wettability and adhesion for accurate component soldering. Its no-clean formula remains moist for up to 36 hours after opening, making it suitable for professional repair and rework applications.
Specifications
- Brand: RELIFE
- Model: RL-403
- Type: BGA Solder Paste / Flux
- Volume: 10cc
- Approx. Weight: 35g
- Alloy Composition: Sn63/Pb37 (63% Tin / 37% Lead)
- Melting Point: 183°C
- Temperature Type: Medium Temperature
- Particle Size: Approx. 20–38 µm
- Formula: No-Clean
- Features: Good Wettability & Adhesion
- Moisture Retention: Up to 36 Hours After Opening
- Application: PCB, SMD & BGA Soldering
- Suitable For: Mobile Phone Motherboard & Electronics Repair