RELIFE RL-044 Universal BGA Reballing Stencil
RELIFE RL-044 is a multi-purpose universal BGA reballing stencil designed for precision IC and CPU repair on mobile phones and other electronic devices. It supports multiple hole sizes and pitch configurations for different BGA chip layouts.
Made from ultra-thin, high-temperature-resistant stainless steel, the stencil combines flexibility and durability for accurate tin planting and solder ball reballing. It features both parallel and 45-degree hole alignment patterns for versatile repair applications.
Specifications
- Brand: RELIFE
- Model: RL-044
- Type: Universal BGA Reballing Stencil
- Material: High-Temperature-Resistant Stainless Steel
- Thickness: Approx. 0.12 mm
- Hole/Pitch Sizes: 0.3 mm, 0.35 mm, 0.4 mm & 0.5 mm
- Hole Alignment: Parallel & 45-Degree Patterns
- Function: Tin Planting & Solder Ball Reballing
- Application: Mobile Phone IC & CPU Repair
- Suitable For: BGA Chips, Logic Boards & PCB Repair
- Design: Ultra-Thin, Flexible & Durable