RELIFE RL-044 SAM18 Precision BGA Reballing Stencil
RELIFE RL-044 SAM18 is a precision BGA reballing stencil designed for micro-soldering and IC repair on smartphone motherboards, particularly Samsung CPU and chipset applications. Its 0.12mm ultra-thin special-steel construction supports repeated bending and spring-back while maintaining structural stability.
The laser-cut aperture design provides accurate alignment with factory chip layouts for clean and consistent solder ball formation. A half-cut etched structure helps protect surrounding components from heat, while integrated ventilation and cooling features reduce heat buildup and minimize stencil warping during hot-air reballing.
Specifications
- Brand: RELIFE
- Model: RL-044 SAM18
- Type: Precision BGA Reballing Stencil
- Application: Samsung CPU & Chipset Reballing
- Material: Premium Special Steel
- Thickness: Approx. 0.12 mm
- Aperture Design: Laser-Cut Round & Square Orifices
- Alignment: Factory Chip Layout Matching
- Etching Design: Half-Cut Micro-Groove Structure
- Heat Protection: Surrounding Component Protection
- Cooling Design: Ventilation & Heat Dissipation Structure
- Anti-Warping: Heat-Resistant Design for Hot-Air Reballing
- Application: Smartphone Motherboard & IC Repair