RELIFE RL-039 BGA/IC Glue Remover Liquid 20ml
RELIFE RL-039 BGA/IC Glue Remover Liquid is designed to soften and dissolve stubborn resin, epoxy, black glue, and other solid adhesives found around mobile phone motherboards, PCBs, and BGA/IC chips. It helps technicians remove hardened adhesive during precision electronics repair.
The 20ml bottle comes with an applicator tool/brush for controlled application around delicate components. It is suitable for professional mobile phone motherboard, PCB, and IC repair work where accurate adhesive removal is required.
Specifications
- Brand: RELIFE
- Model: RL-039
- Type: BGA/IC Glue Remover Liquid
- Volume: 20ml
- Function: Glue Softening & Removal
- Removes: Resin, Epoxy, Black Glue & Solid Adhesives
- Application: Mobile Phone Motherboards, PCBs & BGA/IC Chips
- Applicator: Included Brush/Applicator Tool
- Usage: Precision Electronics & Mobile Phone Repair