RELIFE RL-044 (IPZ13) Precision BGA Reballing Steel Stencil
The RELIFE RL-044 (IPZ13) Precision BGA Reballing Steel Stencil is designed for accurate CPU and integrated circuit (IC) reballing during smartphone motherboard repair. Its precision openings help technicians apply solder balls to chip contact points for reliable rework.
Made with a thin 0.12mm steel sheet, this stencil is intended for specialized chip-level repair work on compatible iPhone 14 series devices. It is suitable for professional mobile phone technicians performing CPU and IC soldering and reballing tasks.
Specifications
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Brand: RELIFE
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Model: RL-044 (IPZ13)
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Type: Precision BGA Reballing Steel Stencil
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Material: Steel
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Thickness: 0.12mm
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Function: CPU and IC Reballing
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Application: Smartphone Motherboard Repair
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Compatibility: Selected iPhone 14 series models with compatible A15/A16 chip layouts
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Suitable For: CPU, IC and BGA Reballing