RELIFE RL-044 OT2 BGA IC Reballing Stencil
The RELIFE RL-044 OT2 BGA IC Reballing Stencil is designed for precision reballing and replacement of mobile storage and memory chips during smartphone motherboard repair. Made from precision steel with a 0.15mm thickness, it provides stencil openings for supported BGA chip layouts.
Suitable for Android device repair, this stencil supports various NAND flash, eMMC, eMCP, UFS, LPDDR and PCIe chip types, depending on the compatible stencil layout. It is a useful tool for technicians performing storage IC reballing and chip-level motherboard maintenance.
Specifications
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Brand: RELIFE
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Model: RL-044 OT2
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Type: BGA IC Reballing Stencil
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Material: Precision Steel
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Thickness: 0.15mm
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Supported BGA Types: BGA153, BGA169, BGA221, BGA186, BGA162, BGA297, BGA200, BGA254, BGA178, BGA110, BGA60 and BGA70
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Supported Chip Types: NAND Flash, eMMC, eMCP, UFS, LPDDR and PCIe (compatible layouts only)
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Function: IC Reballing and Replacement
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Application: Android Smartphone Storage IC and Motherboard Repair