RELIFE RL-044 SAM13 Precision BGA Stencil
The RELIFE RL-044 SAM13 Precision BGA Stencil is designed for precise BGA reballing and integrated circuit repair on compatible Samsung device motherboards. Made from high-hardness, ultra-thin steel with a thickness of 0.12mm, it supports accurate solder ball placement during CPU and IC rework.
Suitable for professional mobile phone repair technicians, this stencil assists with tin planting, chip reballing, and motherboard-level micro-soldering. It is intended for compatible Samsung Exynos and Snapdragon CPU layouts, depending on the specific chip configuration.
Specifications
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Brand: RELIFE
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Model: RL-044 SAM13
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Product Type: Precision BGA Reballing Stencil
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Material: High-Hardness Special Steel
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Thickness: 0.12mm
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Functions: BGA Reballing, Tin Planting, IC Chip Repair
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Compatibility: Selected Samsung Exynos and Snapdragon CPU Layouts
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Application: Samsung Motherboard Repair and Micro-Soldering